Package Solutions
We are capable of satisfying customers product requirements and provide support from development through mass-production.
To meet customers' various requirements, Akita Elpida offers the total solution from development and prototyping to mass-production. We have the necessary expertise of the semiconductor back end processing technology that we have developed as well as the testing technology, cost reduction capabilities, high dependability, the state of the art package development abilities and the world's top level most advanced mounting technology. Please let us know your request such as "We are looking for this kind of package","We want to produce multi-layered packages," and so on. We endeavor to satisfy your requirements, providing a wide range of support from product planning through mass-production.
Development, Prototyping and Mass-Production Flow
Core Technology
1. Assembling technology and printed circuit designing
- Offering small, thin, narrow-pitched packages and the most advanced MCPs, PoPs, and SiPs
2. Testing technology
- Development of testing programs and providing support for reducing testing time
- Swift analysis of product failures and feedback for improving the yield rate
3. Cost reduction
- Offering low cost draft designing to meet customer's specifications
- Contributing to reducing costs with improved yield rate and more appropriate materials management
4. TAT(Turn Around Time)
- Reducing the yield rate loss based on the optimized production processes and on good production management, and providing prompt feedbacks
5. Quality and dependability
- High dependability for the most advanced packages (MCP, PoP, and SiP)
