MCP (Multi Chip Package)
MCP the most advanced PKG technology
MCP is a semiconductor device that has multi semiconductor chips encapsulated in a single package. All the wiring of the multiple stacked semiconductor chips are connected within the package. MCP is well suited for the high density and large capacity requirements. It is also suitable for packages for portable devices such as mobile phones and digital still cameras.These products are requiring further reduction of size and thickness with higher functionality.
Akita Elpida offers the MCPs with FBGA.
FBGA (Fine Pitch Ball Grid Array / die stacked)
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(What is FBGA?)
It is a semiconductor package with external terminals of solder balls that are arranged in a 0.8 mm pitch plaid pattern in the back of the package.
Die stack / smaller and thinner
Super Wiring / for products with higher difficulty
