PoP ( Package on Package )
PoP the most advanced PKG technology
PoP is a semiconductor package made of multiple stacked semiconductor devices. It is possible to make the layers with a combination of different types of semiconductor devices. It is possible to test each of the semiconductor devices separately. This technology helps us to efficiently reduce the yield rate loss, reduce the area size occupied by the package in application, as well as help us to introduce highly value added package quickly into the market by combining semiconductor devices with high dependability.
Also, in case of stacking memory devices with ASICs, it is possible to shorten the wiring length between devices, minimizing the effect of reflection and noises. PoP is a package suitable for portable devices such as mobile phones and digital still cameras.
Features of PoP
- The mounting area can be reduced by package stacked technology.
- Total yield loss can be reduced by stacking test completed packages.
- Influence of reflection and noise can be reduced by shortening the signal line length.
What is PoP?
PoP is a a Jisso technique that stacks over 2 types tested LSI package.
