SiP ( System in Package )
SiP the most advanced PKG technology
SiP is a semiconductor device that has multi LSIs encapsulated in a single package. All the necessary system is integrated in the single device. It is different from SoC, which has all the necessary system integrated on a single chip. SiP has chips that are separately manufactured in different processes, and by wiring all the chips on a single package properly, we are able to provide a semiconductor device with high functionality manufactured in the more stable production process.
By encapsulating into a single package multiple chips that used to be separately installed in multiple chips, we are able to reduce the area size occupied by the system. SiP is suitable for packages for portable devices such as mobile phones and digital still cameras that are requiring further reduction of size and thickness with higher functionality.
Akita Elpida offers the bast SiP system for the customer application.
SiP (System In Package)
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