Many semiconductor chips are employed for mobile phones, smart phones, digital cameras, personal computers, and other digital equipment we daily use.
Akita Elpida Memory, Inc. started its operations in Oct 2006 as the strategic base of Elpida Memory, Inc. for the differentiated semiconductor assembling and testing services.
Elpida Memory has engaged in developing the front end and back end semiconductor processing technology in designing DRAM circuits, developing advanced processing technology, and achieving better productivity. In the area of Premier DRAMs, one of the focal points of Elpida businesses, developing and manufacturing special packages, which require further advanced technology, and securing highly advanced testing technology become vital factors for differentiating the company from its competitors.
Akita Elpida plays the important role for pursuing the mission of the Elpida Group as the central source of developing advanced packages such as MCPs (Mluti Chip Package), PoPs (Package on Package) and SiPs (System in Package) and TSVs (Through Silicon Via), and prototyping and mass producing products that require highly sophisticated packaging technology.
| Company Name | Akita Elpida Memory, Inc. |
|---|---|
| Head Office | 89-2 Yamada, Yuwaishida, Akita-shi, Akita 010-1222 JAPAN |
| Businesses | Development, designing, assembling, and testing of cutting-edge and special semiconductor packages; and customized production of semiconductor logic products |
| Established | Jul 21, 2006 |
| Started Business | Oct 1, 2006 |
| Capital | 310 million yen (100% owned by Elpida Memory, Inc., as of March, 2009) |
| Representative | President Shuichi Otsuka |
| Number of Employees | 420 (as of Mar, 2010) |
Akita Elpida carries out the semiconductor manufacturing business of developing, designing, assembling, and testing cutting-edge and special semiconductor packages, as well as providing customized production of logic products.
Business of developing, designing, assembling and testing of state-of-the-art special semiconductor packages
We have the advanced packaging and chip designing technology for small, thin, and narrow pitched products. This technology is much demanded for the development of state of the art packages such as MCP (Multi Chip Package), PoP (Package on Package), SiP (System in Package), and we are capable of meeting such demand, offering most advanced semiconductor packages.
We offer total solutions, from development and prototyping to mass-production: the assembling expertise for prototyping and mass-producing advanced package products, developing test programs for special packages that require the latest technology, and lot more.
We succeeded in producing the world's thinnest 1.4 mm, 20 layer stacked chip package in April 2007, and are continuously working on sophistication of the packaging expertise and improving the mass-production technology.
Custom Manufacturing Services
Akita Elpida carries out business of customized assembling and testing processes of semiconductors. We offer the best solution to our customers and provide total support from designing and developing products to mass-production, based on the designing and manufacturing expertise and know-how that we have developed as well as the new technology that we acquire.
| Jul 2006 | Akita Elpida Memory, Inc. established. (100% owned by Elpida Memory, Inc.) |
|---|---|
Oct 2006 |
Began operations, taking over the semiconductor businesses of Akita Electronics Systems Co., Ltd. and Akita Semiconductor Co., Ltd. Began operation as the central factory of Elpida for developing and manufacturing most advanced package solutions. |
| Nov 2006 | Designated as a company with a special status to receive Akita Prefecture's assistance for directly investing in Akita |
Jan 2007 |
Certified for the environmental management system ISO 14004: 2004. |
| Apr 2007 | Developed the world's thinnest 1.4 mm multi chip package with 20 stacked dies |
Dec 2007 |
Aligned the areas subject to the ISO14001: 2004 certification and integrated the EMS with the whole Elpida Group's environmental management system. |
Nov 2008 |
New Clean Room Completed (approx. 1,830m²) in Factory Bldg. No. 3 |
| Sep 2009 | Akita Prefecture Environmental Grand Prize Awarded |
Dec 2009 |
Transition to ISO9001: 2008 Quality Management System completed. |
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