In October, 2006, Akita Elpida started its operation as a development center of Elpida Memory, Japan’s sole DRAM maker, in its strategy to differentiate Elpida in backend process.

For today’s diversifying digital equipment such as mobile phones, smart phones, digital cameras, and personal computers, semiconductors are used in large numbers. Akita Elpida assemble and produce such absolutely essential components, which demand miniaturized, thinner, higher functioned, advanced packaging technologies.　  

Akita Elpida takes an important role as a so-called mother center for development and trial and mass production of advanced package products such as MCP (Multi Chip Package), PoP (Package on Package), and TSV (Through Silicon Via).  Having achieved the world’s thinnest 0.8 mm for 4-die stack package, in addition to the 1.4 mm thick 20-die stack package, thinnest in the world as of April, 2007, there is no stop in our pursuit toward building further advanced, higher-leveled packaging and mass production technologies.

Company Name	Akita Elpida Memory, Inc.
Head Office	89-2 Yamada, Yuwaishida, Akita-shi, Akita 010-1222 JAPAN
Businesses	Semiconductor Manufacturing (Development and Production of Advanced Semiconductor Package)
Established	Jul 21, 2006
Started Business	Oct 1, 2006
Capital	310 million yen (100% owned by Elpida Memory, Inc., as of March 31, 2011)
Representative	President Hideki Gomi
Number of Employees	415 (as of September 30, 2011)

Jul 2006	Akita Elpida Memory, Inc. established. (100% owned by Elpida Memory, Inc.)
Oct 2006	Started operations, taking over the semiconductor backend businesses of Akita Electronics Systems Co., Ltd. and Akita Semiconductor Co., Ltd., as a central factory of Elpida Memory, Inc. for development and manufacture of advanced package.
Nov 2006	Accredited as an invited enterprise for regional promotion by Akita Prefecture.
Jan 2007	Certified for the environmental management system ISO 14004: 2004. Certified for the quality management system ISO 9001:2001.
Apr 2007	Developed the world's thinnest 1.4 mm multi chip package with 20 stacked dies
Dec 2007	Consolidated its ISO14001 (2004 version) certification into the Elpida Group's EMS.
Nov 2008	New Clean Room Completed (approx. 1,830m²) in Factory Bldg. No. 3
Sep 2009	Akita Prefecture Environmental Grand Prize Awarded (in Contribution to Recycling Society)
Dec 2009	Transition to ISO9001: 2008 Quality Management System completed.
Apr 2010	Clean Room in Factory Building No. 3 started to operate.
Jun 2011	Achieved mass production technology for the world’s thinnest 0.8 mm 4-die stack DRAM package.