Akita Elpida has been engaged in development and manufacture of high-value added and advanced semiconductor packages as a core backend center for Elpida since its operation started in October, 2006. 

Utilizing the world’s top class technologies and expertise in development and trial and mass production of advanced packages such as MCP, PoP, and TSV, which are all crucial for portable devices typified by smart phones and digital consumer electronics, we have contributed to evolutionary growth of the digital information society.

Our achievements including the 0.8 mm package height in June, 2011, which is the world’s thinnest for 4-die stack, as well as the then thinnest 1.4 mm 20-die stack of April, 2007 clearly show that we have been steadily building higher leveled package technologies and sophisticated mass production technologies.

We are all committed to working together on our high-value added semiconductor package manufacture and cutting edge assembly technology development, aiming to become a world’s top semiconductor backend company in cost, quality, and TAT, and to continue to be trusted by people as reliable and contributing to the society.