Since the start of its operations in Oct 2006, Akita Elpida Memory, Inc., as the Elpida's center for the back-end semiconductor processing, has been striving to expand its business of developing, manufacturing and servicing on highly value-added, state of the art semiconductor packages and advanced mounting engineering based on its world leading technologies.

In this pursuit, we were able to achieve the development of the world's thinnest 1.4mm package with 20 stacked dies in Apr 2007. Using this extensive expertise, Akita Elpida offers the most advanced package solution services for MCPs, PoPs, and SiPs that are chiefly used for mobile devices and digital consumer devices.

Akita Elpida meets customers' various requirements, from development to prototyping and mass production, original from Akita and delivering to the world the state of the art semiconductor packages.

Akita Elpida aims to contribute to the digitalization of the information society and to be the world's No. 1 semiconductor package solution company in cost-efficiency, quality and production efficiency by developing highly value-added semiconductor packages and developing, producing and servicing most advanced mounting technology.

To become the world's No. 1 assembly and testing process company in cost, quality, and turnaround time (TAT) through our development, manufacture, and services of the high value-added semiconductor packages and advanced packaging technologies.