In the back-end process of the semiconductor manufacturing, resin (plastic-encapsulating resin) is used for chip packaging. Plastic-encapsulating multiple chips all together saves packaging material and also reduces mounting area more than plastic-encapsulating one by one and then mounting on the substrate.

Akita Elpida develops and produces highly functional and yet less energy- and material-consuming products by its resource-saving technology which enables "small, thin, stacked" semiconductor packages. We will continue to contribute to the environmental improvement for our customers and the society as a whole.

We are reducing CO2 emission per product (Production Volume Unit: gCO2/piece) by improving the productivity at the factory, renewal of the air conditioning equipment, increase in the production quantities, and enhancement in bit density. Compared with Year 2006, 37% was reduced in Year 2008　following the increase in production of high density products.

Akita Elpida is pursuing resource saving by focusing on the production of chip stacked packages such as Multi Chip Package (MCP). Per chip resin use can be reduced down to half or 1/3 of that of the single layer product by MCP. The stacking rate (the number of chips divided by the number of packages) was 120%, 13% up year on year in Year 2008. We will continue to expand the production of the stacked packages in Year 2009.

Akita Elpida is promoting evaluation of industrial and nonindustrial waste. Switching from thermal recycling to material recycling for a part of the waste, we further contribute to resource recycling and waste disposal cost reduction. In Year 2008, newly evaluated were metal debris from electronic appliances, paper materials such as carton boxes, and plastic waste such as sheets, tapes, and cases. The waste as valuable resources amounted to 55t in Year 2008 up from 20t in Year 2007.

In Year 2008, the office air conditioning equipment was renewed to the energy-saving types and the air conditioning efficiency was improved. In addition, light shielding films were pasted on all the office windows (approximately 50) to control the rise in the office temperature due to the sunlight by about 5℃ in actual measurement, which resulted in 30% year on year reduction from 2007 in the electricity consumption by the entire office.