We offer compact, thin packages fulfilling our customers' needs and their intended applications.
Introduced here are our elementary/component technologies accumulated through the development efforts such as achieving the 20-die stack package.
We address our customers' diverse needs ranging from development, trial production to mass production. Test outsourcing is included.
From Akita to the world, we deliver advanced semiconductor packages enabled by the sophisticated technologies and production know‐hows we have built up.
