In a single MCP, multiple chips are encapsulated, wire-connected to the substrate, the substrate working as the base of the package. Those chips are stacked or placed side by side inside the package in configurations such as Ball Grid Array (BGA) and Quad Flat Package (QFP), and thus it is hard to tell from its appearance whether the package is MCP or not. Akita Elpida’s MCPs are in a Fine Ball Grid Array (FBGA) configuration with narrower clearances between the solder balls (external connection terminals on the backside of the package).

<MCP's Advantages>

• Connecting multiple chips of different functions and encapsulating in a single package, MCP allows more mounting area on appliances and devices. In particular, by employing advanced chip stacking technologies, compact electronic devices such as mobile phones and digital cameras make efficient use of the mounting space.
• MCP enables best-suited chip combination required for specific purposes and applications, allowing efficient development, and accelerating the time to market.

Key Technology

1. Wafer thinning technology
2. Technology for picking up and die-attaching thinner chip
3. Low loop wire bonding technology
4. Overhang wire bonding technology

• Technology
• Akita Elpida Memory Successfully Develops World's Thinnest 1.4 mm MCP with 20 Stacked Dies. (Apr 23,2007)