Package		-
CSP	FBGA (Fine pitch Ball Grid Array)
	RCSP (Real Chip Size Package)
MCP (Multi Chip Package)		Multi-die FBGA
PoP Package on Package		PoP(FBGA)
CoC (TSV) (Chip on Chip) (Through SiVia) ∴Under development		CoC (TSV)
Conventional Packages		TSOP, LQFP, etc

Monolithic

Package Size(mm)		Ball Pitch(mm)
X	Y	1.0	0.8			0.75	0.65		0.5			0.4
4	4								41P
4.2	4.2											80P
5	5								57P
5.5	5.5								100P			139P
6	5.5								60P
6	6											145P
6.5	6.5											180P
7	7								107P	161P
10.5	10		60P
10.5	10.5		144P
11.5	11		60P
12	12		144P
13	11		90P

*Production

*Package Lineup here presents the packages addressed to open tools.

MCP/SiP

Package Size(mm)		Ball Pitch(mm)
X	Y	1.0	0.8			0.75	0.65		0.5			0.4
4	4								47P
6	6								121P
7	7								169P
8	8								225P
8	9						130P
8	13		137P
9	9						130P		176P	278P		321P
9	11						138P
10	7								221P
10	10						163P
10	12.5								340P
10.4	12						151P
10.5	13		107P	137P
11	13		90P	107P	137P
11.5	11.5						160P
12	12						289P		272P
12	13		137P
12	16								169P
13	13		256P
15	15		289P
20	20	305P

*Production

*Package Lineup here presents the packages addressed to open tools.

PoP（TOP PKG）

Package Size(mm)		Ball Pitch(mm)
X	Y	1.0	0.8			0.75	0.65		0.5			0.4
12	12						128P		168P			216P
13	12
13	13						72P
13.3	13.3											384P
13	14
14	14						152P	215P		223P	240P
15	15						160P

*Production

*Package Lineup here presents the packages addressed to open tools.