Multiple different LSIs are assembled into individual packages and tested, and again those packages are stacked and assembled into packages, forming PoPs. Reduction in mounting space and wire length is one of the PoP’s advantages.

<PoP's Advantages>

• By stacking multiple packages, more mounting areas on devices and appliances are secured.
• Packages can be respectively tested, which enables reduction in yield losses.
• Reduction in wire length is achieved, minimizing the impact of reflection and noise generated when memory and ASIC chips are combined.
• Only by replacing the chips to stack, upgrade such as memory capacity increase is easily performed, enabling significant reduction in the cost and time for development.