TSV (Through Silicon Via) is a 3-dimensional stack packaging technology, wherein small through holes　are made in chips and the holes are filled with metal for electrical connection of sandwich-like stacked　chips.  Compared with the conventional method to wirebond multiple chips, this technology significantly reduces wiring distance, bringing out big advantages in terms of speed, power saving, and miniaturization.

For TSV, the next generation’s noteworthy, key technology, Akita Elpida has been working on the development project Elpida started in 2004 with a grant from NEDO (New Energy and Industrial Technology Development Organization)  In 2009, we achieved the world’s first TSV DRAM product, which was 9-layered, consisting of eight 1GBit DDR3 SDRAM dies and one interface layer.

In June, 2011, aｓ the world’s　very  first again, we shipped out TSV samples of DDR SDRAM (x32), one of our eco-friendly products aiming to significantly reduce system power consumption.  TSV products greatly contribute to must features of ultra thin laptop PCs and tablet PCs now dramatically expanding the market; energy saving, miniaturization, weight saving, and thinness.

News release from Elpida Memory, Inc. (June 27, 2011)