Akita Elpida provides a total support from development to trial production and mass production taking advantage of its semiconductor packaging technologies, testing technologies, cost reduction solution, and high reliability, to meet and address customers’ various needs, in addition to the advanced package development capability and the world’s top-class advanced packaging technologies.

Akita Elpida offers a total cost reduction plan unique to its own, which includes not only total process support but also process shortening, cost reduction, and yield improvement that it has accumulated for compact, thin, and multi layers. Akita’s reliable high efficient production lines are accredited by many customers from around the world as well as its evaluation analysis/testing technologies based on the rich expertise and experiences in various memory devices.

In order to make the most use of the advantage of being a subsidiary company of Elpida Memory, Japan’s only specialized DRAM maker, Akita Elpida works hard for further improvement in quality and various other aspects by feeding back its extensive data related to the back end process to the front end process and thereby offering the best-suited memory products for the customers.

We are also engaged in outsource production using other memory than Elpida’s, but utilizing the membership of the Elpida Group, our package solution is very unique and no comparison with other assembly makers' since we ensure stable memory supply for Elpida DRAM users.

We always welcome customers' voiced needs such as "We want package like this," "We want to achieve multiple layered stacked package," "We need to reduce the cost," and so on. Akita Elpida is sure to offer a comprehensive range of support from product planning to mass production addressing such customers' requests and needs.

• Professional DRAM design and engineering
• Integrated services PCB design, Package design, Evaluation, Sample, MP, Characterization Analysis and feedback
• Short TAT (Turn Around Time)
  Assembly TAT : 2.5 to 3 days on average for single die package
• Competitive cost
  Yield improvement (Customers do not need to care about DRAM yield)
  Test Program development and Test time optimization
• Qualified by world wide customers
  Qualified BGA manufacturing line and Design-in with World wide customers such as TI, Motorola, Nokia, Sony, Canon, Panasonic, Renesas, Ricoh, etc.