| － | 2008 | 2009 | 2010 | 2011 |
|---|---|---|---|---|
| Thin typepackage |  |
|||
| Fine Ball Pitch package |  |
|||
| Small typepackage (Smallest distance of PKG-Die) |
 |
|||
| SiP |  |
|||
| 2008 | 2009 | 2010 | 2011 | |
|---|---|---|---|---|
| Wafer thickness |  |
|||
| (Dicing echnology) |  |
|||
| Upper Resin hickness (Molding Technology) |
 |
|||
| Substrate thickness |  |
|||
| Wire loop height |  |
|||
| (CoC Technology) |  |
|||
Production / Production ready ・Under development
